Call with Digital Partnership and TTC countries

**A pályázat célja és várt eredménye** Expected Outcome: The focus needs to be on areas where Digital Partnership countries bring strong complementary expertise, including advanced packaging, heterogeneous integration, and photonic chip technologies. The topic would aim to foster collaboration between European and Digital Partnership countries’ R&I communities. Projects are expected to contribute to the following outcomes: • Innovative design and integration concepts for neuromorphic computing systems supporting very low energy consumption, connectivity, embedded functions for mobile applications. • Alternative manufacturing process technologies for semiconductor chips including frontend or backend for heterogenous integration. The technologies should sustain in the mid- and long-term the fast-paced evolution of device performance, miniaturisation and cost, while reducing the environmental footprint. • Very advanced packaging solutions aiming heterogeneous integration of multiple functions and materials for applications in communication (RF, mmW or THz), sensing, actuating, power management and active/passive integration. **Jogosultsági és benyújtási feltételek** "> General conditions 1. Admissibility conditions: Proposal page limit and layout described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026 . Proposal page limits and layout: described in Part B of the Application Form available in the Submission System. 2. Eligible countries described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026 . A number of non-EU/non-Associated Countries that are not automatically eligible for funding have made specific provisions for making funding available for their participants in Horizon Europe projects. See the information in the Horizon Europe Programme Guide . 3. Other Eligibility Conditions described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026 . 4. Financial and operational capacity and exclusion described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026 . 5a. Evaluation and award: Award criteria, scoring and thresholds described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026 . 5b. Evaluation and award: Submission and evaluation processes described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026 . 5c. Evaluation and award: Indicative timeline for evaluation and grant agreement described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026 . 6. Legal and financial set-up of the grants described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026 and in the Annex G of the Work Programme General Annexes. Specific conditions described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026 Call Details Application and evaluation forms and model grant agreement (MGA): Application form templates Please use the application form that you will find in the Submission System. You can find examples of standard application forms in the Reference Documents page . Guidance HE Programme Guide Model Grant Agreements (MGA) HE MGA Call-specific instructions Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026 Information on financial support to third parties (HE) Additional documents: EU Financial Regulation 2024/2509 Funding & Tenders Portal Online Manual Funding & Tenders Portal Terms and Conditions Funding & Tenders Portal Privacy Statement